Light emitting diode containing a grating and methods of making the same
AssigneeNanosys, Inc.
InventorZhen Chen
Life of this patent
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Abstract
A light emitting diode (LED) includes a n-doped semiconductor material layer, a p-doped semiconductor material layer, an active region disposed between the n-doped semiconductor layer and the p-doped semiconductor layer, and a photonic crystal grating configured to increase the light extraction efficiency of the LED.
Claims23
A light emitting diode (LED), comprising:
- a n-doped semiconductor material layer;
- a p-doped semiconductor material layer;
- an active region disposed between the n-doped semiconductor layer and the p-doped semiconductor layer;
- and
- a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less.
A light emitting diode (LED), comprising:
- a n-doped semiconductor material layer;
- a p-doped semiconductor material layer;
- an active region disposed between the n-doped semiconductor layer and the p-doped semiconductor layer;
- and
- a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less, the grating comprises nanostructures configured to guide the light emitted from the active region in a direction substantially perpendicular to a plane of the active region, and the nanostructures are located between the n-doped semiconductor material layer and the active region.
A light emitting diode (LED), comprising:
- a n-doped semiconductor material layer;
- a p-doped semiconductor material layer;
- an active region disposed between the n-doped semiconductor layer and the p-doped semiconductor layer;
- a buffer semiconductor layer, wherein the n-doped semiconductor material layer is located between the active region and the buffer semiconductor layer, and
- a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less, the grating comprises nanostructures configured to guide the light emitted from the active region in a direction substantially perpendicular to a plane of the active region, and the nanostructures are located on a lower surface of the buffer semiconductor layer opposite to an upper surface facing the active region.
A light emitting diode (LED), comprising:
- a n-doped semiconductor material layer;
- a p-doped semiconductor material layer;
- an active region disposed between the n-doped semiconductor layer and the p-doped semiconductor layer;
- a buffer semiconductor layer, wherein the n-doped semiconductor material layer is located between the active region and the buffer semiconductor layer, and
- a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less, the grating comprises nanostructures configured to guide the light emitted from the active region in a direction substantially perpendicular to a plane of the active region, and the nanostructures are located in the buffer semiconductor layer.
A light emitting diode (LED), comprising:
- a n-doped semiconductor material layer;
- a p-doped semiconductor material layer;
- an active region disposed between the n-doped semiconductor layer and the p-doped semiconductor layer;
- a buffer semiconductor layer, wherein the n-doped semiconductor material layer is located between the active region and the buffer semiconductor layer, and
- a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less, the grating comprises nanostructures configured to guide the light emitted from the active region in a direction substantially perpendicular to a plane of the active region, and the nanostructures are located in the n-doped semiconductor material layer.
A method of forming a light emitting diode (LED), comprising:
- forming a n-doped semiconductor material layer over a substrate;
- forming an active region over the n-doped semiconductor material layer;
- forming a p-doped semiconductor material layer over the active region;
- forming a reflector over the p-doped semiconductor material layer;
- and
- forming a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less.
A method of forming a light emitting diode (LED), comprising:
- forming a n-doped semiconductor material layer over a substrate;
- forming an active region over the n-doped semiconductor material layer;
- forming a p-doped semiconductor material layer over the active region;
- forming a reflector over the p-doped semiconductor material layer;
- and
- forming a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less, wherein the grating comprises nanostructures configured to guide the light emitted from the active region in a direction substantially perpendicular to a plane of the active region, and the nanostructures are located between the n-doped semiconductor material layer and the active region.
A method of forming a light emitting diode (LED), comprising:
- forming a n-doped semiconductor material layer over a substrate;
- forming an active region over the n-doped semiconductor material layer;
- forming a p-doped semiconductor material layer over the active region;
- forming a reflector over the p-doped semiconductor material layer;
- forming a photonic crystal grating configured to increase the light extraction efficiency of the LED, wherein the LED has a width of 100 microns or less, wherein the grating comprises nanostructures configured to guide the light emitted from the active region in a direction substantially perpendicular to a plane of the active region;
- and
- forming a buffer semiconductor layer, such that the n-doped semiconductor material layer is formed over an upper surface of the buffer semiconductor layer,
- wherein the nanostructures are located on a lower surface of the buffer semiconductor layer opposite to the upper surface, in the buffer semiconductor layer, or in the n-doped semiconductor material layer.
Dependencies are inferred from the claim text.