Transfer method, display device, and storage medium

A display device, wherein the display device comprises a display substrate fixedly provided with LED chips, and the LED chips are transferred by a transfer method, comprising:

• performing partial cutting on preset scribe lines on an epitaxial layer on a growth substrate to obtain to-be-transferred wafers after cutting, wherein a cutting depth is less than a depth of the epitaxial layer;
• providing a temporary substrate having a first release adhesive, adhering the first release adhesive to first side faces of the to-be-transferred wafers so as to adhere the to-be-transferred wafers to the temporary substrate, and peeling off the growth substrate;
• providing a blue tape having a second release adhesive, adhering the second release adhesive to second side faces of the to-be-transferred wafers so as to adhere the to-be-transferred wafers to the blue tape, and peeling off the temporary substrate, wherein the first side faces and the second side faces are arranged in opposite correspondingly;
• and
• providing a roller that is arranged at the bottom of the blue tape and opposite to the to-be-transferred wafers, and jacking up the blue tape with the roller so that remaining scribe lines on the to-be-transferred wafers are separated by breaking under action of stress.

A non-transitory computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to:

• perform partial cutting on preset scribe lines on an epitaxial layer on a growth substrate to obtain to-be-transferred wafers after cutting, wherein a cutting depth is less than a depth of the epitaxial layer;
• provide a temporary substrate having a first release adhesive, adhere the first release adhesive to first side faces of the to-be-transferred wafers so as to adhere the to-be-transferred wafers to the temporary substrate, and peel off the growth substrate;
• provide a blue tape having a second release adhesive, adhere the second release adhesive to second side faces of the to-be-transferred wafers so as to adhere the to-be-transferred wafers to the blue tape, and peel off the temporary substrate, wherein the first side faces and the second side faces are arranged in opposite correspondingly;
• and
• provide a roller that is arranged at the bottom of the blue tape and opposite to the to-be-transferred wafers, and jack up the blue tape with the roller so that remaining scribe lines on the to-be-transferred wafers are separated by breaking under action of stress.