US 11,695,003 B2 · Semiconductor device, electronic system, and electrostatic discharge protection method for semiconductor device thereof

Abstract

The present application discloses a semiconductor device, an electronic system and an electrostatic discharge (ESD) protection method for a semiconductor device thereof. The semiconductor device includes a substrate, an operation solder structure disposed on a first surface of the substrate for receiving an operation signal, a detection solder structure disposed on the first surface of the substrate for receiving a chip connection signal, and a semiconductor chip disposed on a second surface of the substrate. The semiconductor chip includes an operation electrical contact coupled to the operation solder structure, a detection electrical contact coupled to the detection solder structure, an ESD protection unit coupled to the operation electrical contact, and a logic circuit coupled to the detection electrical contact for adjusting capacitance of the ESD protection unit according to the chip connection signal.

Claims16

Dependent claims

A semiconductor device, comprising:

a substrate;
an operation solder structure disposed on a first surface of the substrate and configured to receive an operation signal;
a detection solder structure disposed on the first surface of the substrate, and configured to receive a chip connection signal;
and
a first semiconductor chip disposed on a second surface of the substrate, and comprising:
a first operation electrical contact coupled to the operation solder structure through the substrate;
a first detection electrical contact coupled to the detection solder structure through the substrate;
a first electrostatic discharge (ESD) protection unit coupled to the first operation electrical contact;
and
a first logic circuit coupled to the first detection electrical contact, and configured to adjust a capacitance of the first ESD protection unit according to the chip connection signal.

7 more elements

An electronic system comprising:

a circuit board;
and
a first semiconductor device coupled to the circuit board, and comprising:
a first substrate;
a first operation solder structure disposed on a first surface of the first substrate and configured to receive a first operation signal;
a first detection solder structure disposed on the first surface of the first substrate, and configured to receive a first chip connection signal;
and
a first semiconductor chip disposed on a second surface of the first substrate, and comprising:
a first operation electrical contact coupled to the first operation solder structure;
a first detection electrical contact coupled to the first detection solder structure;
a first electrostatic discharge (ESD) protection unit coupled to the first operation electrical contact;
and
a first logic circuit coupled to the first detection electrical contact, and configured to adjust a capacitance of the first ESD protection unit according to at least the first chip connection signal.

10 more elements

Dependencies are inferred from the claim text.

Semiconductor device, electronic system, and electrostatic discharge protection method for semiconductor device thereof

Life of this patent

Semiconductor device, electronic system, and electrostatic discharge protection method for semiconductor device thereof

Life of this patent

Abstract

Claims16