Electronic device and fabrication method thereof
AssigneeInnolux Corporation
InventorYeong-E Chen
Life of this patent
Estimating the term…
Abstract
An electronic device and a fabrication method thereof are provided. The electronic device includes a circuit structure layer, a package structure, an electronic element, and a plurality of function elements. The circuit structure layer has a first side and a second side opposite to the first side. The package structure is disposed on the first side of the circuit structure layer. The electronic element is embedded or encapsulated in the package structure. The function elements are disposed on the second side of the circuit structure layer. The function elements are electrically connected to the electronic element through the circuit structure layer. The electronic device provided by the disclosure exhibits borderless design or has a large function region.
Claims18
An electronic device, comprising:
- a circuit structure layer, having a first side and a second side opposite to the first side;
- a package structure, disposed on the first side of the circuit structure layer and having a first thickness;
- an electronic element, embedded in the package structure and having a second thickness;
- and
- a plurality of function elements, disposed on the second side of the circuit structure layer and electrically connected to the electronic element through the circuit structure layer,
- wherein the first thickness of the package structure is greater than or equal to 1.5 times the second thickness of the electronic element, and the package structure includes a single layer structure.
A fabrication method of an electronic device, comprising:
- arranging a circuit structure layer on a carrier substrate, wherein the circuit structure layer has a first side and a second side opposite to the first side;
- arranging an electronic element having a second thickness on the first side of the circuit structure layer;
- arranging a package structure having a first thickness on the electronic element and the first side of the circuit structure layer, wherein the electronic element is embedded in the package structure;
- and
- arranging a plurality of function elements on the second side of the circuit structure layer, wherein the plurality of function elements are electrically connected to the electronic element through the circuit structure layer,
- wherein the first thickness of the package structure is greater than or equal to 1.5 times the second thickness of the electronic element, and the package structure includes a single layer structure.
Dependencies are inferred from the claim text.