Method for transferring chips
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsFrank Fournel, Emilie Bourjot, Séverine Cheramy, Sylvain Maitrejean, Loic Sanchez
Life of this patent
Estimating the term…
Abstract
A method for transferring at least one chip, from a first support to a second support, includes forming, while the chip is assembled to the first support, an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support and a solidification of the interlayer. Then, the chip is detached from the first support while maintaining the interlayer in the solid state.
Claims16
A method for transferring at least one chip, from a first support to a second support, comprising:
- forming, while the chip is integral with the first support, an interlayer in a liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support, and then a solidification of the interlayer in a solid state;
- and
- then, detaching the chip from the first support while maintaining the interlayer in the solid state,
- wherein the solidification comprises placing the assembly surface of the face of the second support at a temperature below a solidification temperature of the interlayer,
- wherein the forming the interlayer comprises forming a liquid coating configured to form the interlayer on the front face of the chip, then approaching the first support and the second support so as to contact the liquid coating and the assembly surface of the face of the second support,
- wherein the placing the assembly surface of the face of the second support at a temperature below a solidification temperature of the interlayer is carried out before contacting the liquid coating with the assembly surface of the face of the second support, and
- wherein the detaching comprises a relative displacement of the first support and of the second support configured to break a mechanical bond between the first support and the chip.
A method for transferring at least one chip, from a first support to a second support, comprising:
- forming, while the chip is integral with the first support, an interlayer in a liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support, and then a solidification of the interlayer in a solid state;
- and
- then, detaching the chip from the first support while maintaining the interlayer in the solid state,
- wherein the solidification comprises placing the assembly surface of the face of the second support at a temperature below a solidification temperature of the interlayer,
- wherein the forming the interlayer comprises forming a liquid coating configured to form the interlayer on the front face of the chip, then approaching the first support and the second support so as to contact the liquid coating and the assembly surface of the face of the second support,
- wherein the placing the assembly surface of the face of the second support at a temperature below a solidification temperature of the interlayer is carried out before contacting the liquid coating with the assembly surface of the face of the second support,
- wherein the first support is a chip pick and place head, and wherein the detaching comprises deactivating a system for holding the chip on the pick and place head, and
- wherein the forming the interlayer, successively comprises:
- picking up the chip, by a rear face opposite the front face, by the pick and place head from an initial support of the chip, the picking up comprising activating the system for holding the chip and raising the chip relative to the initial support;
- first displacing the pick and place head to a droplet deposition tool;
- forming a droplet, configured to form the interlayer, on the front face of the chip by the droplet deposition tool, the droplet deposition tool being positioned beneath the front face when the droplet is formed;
- and
- second displacing the pick and place head to the second support, the second displacing including lowering the chip so that the droplet contacts the face of the support from above the face of the support.
Dependencies are inferred from the claim text.