Die bonding method with corner or side contact without impact force
AssigneeSaultech Technology Co., Ltd.
InventorYen Hao Lu
Life of this patent
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Abstract
A die bonding method with corner or side contact without impact force includes the steps: picking up a die by a die bonding device, wherein a surface of the die has no solder and bump; moving the die to one side of a die placement area of a substrate, wherein the substrate has no solder and bump; blowing one corner or one side of the die a positive pressure from the die bonding device to bend the corner/side to contact the die placement area; forming a bonding wave after the corner/side of the die contacting the die placement area, and spreading the bonding wave from the corner/side to opposite corner/side of the die, and separating the die from the die bonding device gradually and bonding the die on the die placement area; and bonding the die on the die placement area completely.
Claims20
A die bonding method with corner or side contact without impact force, comprising the following steps:
- (a) a die bonding device picking up a die, and the die being free of solder and bump on surface;
- (b) the die bonding device moving the die to one side of a die placement area of a substrate, and the substrate being free of solder and bump on surface;
- (c) the die bonding device blowing one corner or one side of the die by a positive pressure, thereby bending the corner or the side of the die to contact the die placement area;
- (d) forming a bond wave after the corner or the side of the die contacting the die placement area, and spreading the bond wave from the corner of the die to opposite corner of the die or from the side of the die to opposite side of the die, so that the die separating from the die bonding device gradually and becoming bonded on the die placement area;
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- (e) the die being bonded on the die placement area completely.
A die bonding method with corner or side contact without impact force, comprising the following steps:
- (a) a die bonding device picking up a die, and the die being free of solder and bump on surface;
- (b) the die bonding device moving the die to one side of a die placement area of a substrate, and the substrate being free of solder and bump on surface;
- (c) the die bonding device blowing one corner or one side of the die by a positive pressure, thereby bending the corner or the side of the die to contact the die placement area;
- (d) forming a bond wave after the corner or the side of the die contacting the die placement area, and spreading the bond wave from the corner of the die to opposite corner of the die or from the side of the die to opposite side of the die, then the positive pressure gradually weakening and further switching to a negative pressure, so that the die separating from the die bonding device gradually and becoming bonded on the die placement area;
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- (e) the die being bonded on the die placement area completely.
Dependencies are inferred from the claim text.