Active package substrate having anisotropic conductive layer
AssigneeIntel Corporation
InventorsJuan Eduardo Dominguez, Hyoung Il Kim
Life of this patent
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Abstract
Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.
Claims22
A package substrate, comprising:
- a bottom substrate layer,
- a die mounted on the bottom substrate layer, wherein the die includes a die pad, the die pad embedded in the die;
- a top substrate layer over the die, wherein the top substrate layer includes a via;
- and
- an anisotropic conductive layer between the die pad and the via, the anisotropic conductive layer in direct physical contact with the die pad, wherein the via is electrically connected to the die pad through the anisotropic conductive layer.
A semiconductor package, comprising:
- a package substrate including
- a die including a die pad,
- a top substrate layer including a via, and
- an anisotropic conductive layer between the via and the die pad, wherein the via is electrically connected to the die pad through the anisotropic conductive layer, and
- a memory die mounted on the top substrate layer of the package substrate, wherein the memory die includes an electrical bump connected to the via.
A package substrate, comprising:
- a bottom substrate layer;
- a die mounted on the bottom substrate layer, wherein the die includes a die pad;
- a top substrate layer over the die, wherein the top substrate layer includes a via;
- an anisotropic conductive layer between the die pad and the via, wherein the via is electrically connected to the die pad through the anisotropic conductive layer, wherein the anisotropic conductive layer includes an anisotropic conductive adhesive, and wherein the anisotropic conductive adhesive conducts electrical current unidirectionally along a vertical axis between the via and the die pad;
- an epoxy layer surrounding the die between the top substrate layer and the bottom substrate layer;
- and
- a bottom anisotropic conductive layer between the die and the bottom substrate layer, wherein the bottom substrate layer includes a bottom via electrically connected to the bottom anisotropic conductive layer below the die.
A package substrate, comprising:
- a bottom substrate layer;
- a die mounted on the bottom substrate layer, wherein the die includes a die pad;
- a top substrate layer over the die, wherein the top substrate layer includes a via;
- and
- an anisotropic conductive layer between the die pad and the via, wherein the via is electrically connected to the die pad through the anisotropic conductive layer, wherein the anisotropic conductive layer includes an anisotropic conductive adhesive, wherein the anisotropic conductive adhesive conducts electrical current unidirectionally along a vertical axis between the via and the die pad, wherein the anisotropic conductive layer includes a conductive column extending along the vertical axis, wherein an insulating trench surrounds the conductive column, and wherein the via is electrically connected to the die pad through the conductive column.
A method, comprising:
- mounting a die on a bottom substrate layer, wherein the die includes a die pad, the die pad embedded in the die;
- forming an anisotropic conductive layer over the die pad, the anisotropic conductive layer in direct physical contact with the die pad;
- and
- forming a top substrate layer over the anisotropic conductive layer, wherein the top substrate layer includes a via electrically connected to the die pad through the anisotropic conductive layer.
Dependencies are inferred from the claim text.