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US 11,694,984 B2Granted
Package structure including pillars and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long Lu
Life of this patent
Estimating the term…
Abstract
A package structure includes a base material, at least one electronic device, at least one encapsulant and a plurality of dummy pillars. The electronic device is electrically connected to the base material. The encapsulant covers the electronic device. The dummy pillars are embedded in the encapsulant. At least two of the dummy pillars have different heights.
Claims14
A package structure, comprising:
- a base material;
- a first encapsulant disposed over the base material;
- and
- a plurality of first pillars encapsulated by the first encapsulant, wherein the plurality of first pillars have at least three different heights,
- wherein a height of one of the plurality of first pillars near a center of the base material is less than a height of another one of the plurality of first pillars away from the center of the base material so as to reduce a largest warpage located at a periphery of the base material and reduce a smallest warpage located at the center of the base material,
- wherein each of the plurality of first pillars has a top surface, and the top surfaces of the plurality of first pillars are covered by the first encapsulant.
3 more elements
A package structure, comprising:
- a base material;
- a first encapsulant disposed over the base material;
- a plurality of first pillars encapsulated by the first encapsulant, wherein the plurality of first pillars have at least three different heights, wherein a height of one of the plurality of first pillars near a center of the base material is less than a height of another one of the plurality of first pillars away from the center of the base material so as to reduce a largest warpage located at a periphery of the base material and reduce a smallest warpage located at the center of the base material;
- and
- a first conductive pad disposed adjacent to a first side of the base material, wherein at least two of the plurality of first pillars are disposed over the first conductive pad and have different heights.
2 more elements
A package structure, comprising:
- a substrate;
- a first encapsulant disposed over the substrate;
- a plurality of first pillars encapsulated by the first encapsulant;
- a second encapsulant disposed under the substrate;
- and
- a plurality of second pillars encapsulated by the second encapsulant,
- wherein a height of one of the plurality of first pillars near a center of the substrate is less than a height of another one of the plurality of first pillars away from the center of the substrate,
- wherein a height of one of the plurality of second pillars near the center of the substrate is less than a height of another one of the plurality of second pillars away from the center of the substrate,
- wherein the second encapsulant exposes a portion of a bottom surface of the substrate, and a lateral surface of the second encapsulant is slanted with respect to the bottom surface of the substrate.
6 more elements
Dependencies are inferred from the claim text.