US 11,694,977 B2Granted

Method for producing a connection between component parts

AssigneeOSRAM Opto Semiconductors GmbH

InventorsSimeon Katz, Sophia Huppmann, Michael Hoenle, Thorsten Wagner, Kurt Hingerl

Life of this patent

Estimating the term…

Loading patent…

Abstract

In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.

Claims20

Dependent claims

A method for producing a mechanical and electrical connection between a first component part and a second component part, the method comprising:

providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias;
providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias;
and
joining the component parts such that, in a plan view, the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers which are planarized in places,
wherein an exposed surface of the first component part is formed exclusively of surfaces of the first contact layer and of the first insulating layer, the first contact layer directly adjoining the first insulating layer,
wherein an exposed surface of the second component part is formed exclusively of surfaces of the second contact layer and of the second insulating layer, the second contact layer directly adjoining the second insulating layer, and
wherein, when the component parts are joined together, a common interface is formed between the component parts, the common interface being a common connection plane formed exclusively by overlapping of the planarized surfaces of the first and second contact layers.

4 more elements

A component comprising:

a first component part;
and
a second component part,
wherein the first component part has a first insulating layer, a plurality of first through-vias and a first contact layer structured in places, the first through-vias each being laterally enclosed by the first insulating layer, and the first contact layer directly adjoining the first insulating layer, partially covering the first insulating layer and completely covering the first through-vias,
wherein the second component part has a second insulating layer, a plurality of second through-vias and a second contact layer structured in places, the second through-vias each being laterally enclosed by the second insulating layer, and the second contact layer directly adjoining the second insulating layer, partially covering the second insulating layer and completely covering the second through-vias,
wherein a mechanical and electrical connection is formed between the component parts at the contact layers,
wherein a common interface is located between the component parts, and
wherein the common interface is a common connection plane formed exclusively by overlapping the planarized surfaces of the first contact layer and of the second contact layer.

5 more elements

Dependencies are inferred from the claim text.