Semiconductor die with warpage release layer structure in package and fabricating method thereof

A chip package structure, comprising:

• an interposer substrate;
• a molding compound layer formed over the interposer substrate;
• first and second semiconductor dies bonded over the interposer substrate and surrounded by the molding compound layer;
• and
• a warpage release layer structure, comprising:
• a first polyimide layer in direct contact with upper surfaces of the first and second semiconductor dies;
• and
• first and second metal layers, formed over the first polyimide layer and separated from each other to respectively cover the upper surface of the first semiconductor die and the upper surface of the second semiconductor die.

A method for forming a chip package structure, comprising:

• mounting first and second semiconductor dies over an interposer substrate;
• forming an encapsulating layer over the interposer substrate to surround the first and second semiconductor dies;
• forming a first organic material layer in direct contact with upper surfaces of the first and second semiconductor dies and the encapsulating layer;
• and
• forming first and second metal layers over the first organic material layer, wherein the first and second metal layers are separated from each other to respectively cover the upper surface of the first semiconductor die and the upper surface of the second semiconductor die.