Semiconductor package with heatsink
AssigneeMediatek Inc.
InventorsKuang-Han Chang, Yu-Liang Hsiao, Chih-An Yang
Life of this patent
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Abstract
A semiconductor package includes a substrate, a semiconductor die mounted on the substrate, and a heatsink over the semiconductor die. The heatsink includes a roof portion and at least one connecting portion extending between the roof portion and the substrate. The at least one connecting portion includes a connection lead mounted on a connection pad of the substrate. The connection pad includes a first portion and a second portion spaced apart from each other, which are configured to electrically couple to different voltage signals, respectively, for detecting heatsink floating.
Claims17
A semiconductor package, comprising:
- a substrate;
- a semiconductor die mounted on the substrate;
- and
- a heatsink over the semiconductor die, wherein the heatsink comprises a roof portion and at least one connecting portion extending between the roof portion and the substrate, wherein the at least one connecting portion comprises a connection lead mounted on and electrically connected to a split connection pad of the substrate, wherein the split connection pad comprises a first portion and a second portion spaced apart from each other, wherein the first portion is coplanar with the second portion, and wherein the first portion is electrically connected to a first voltage signal, and the second portion is electrically connected to a second voltage signal that is different from the first voltage signal.
Dependencies are inferred from the claim text.