Flexible circuit board and chip package including same
AssigneeLG Innotek Co., Ltd.
InventorsJun Young Lim, Hyung Kyu Yoon, Sung Min Chae
Life of this patent
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Abstract
A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
Claims19
A flexible circuit board comprising:
- a substrate;
- a first conductive pattern part disposed on a first surface of the substrate;
- a second conductive pattern part disposed on a second surface opposite to the first surface of the substrate;
- a first dummy pattern part disposed in a region of the second surface of the substrate in which the second conductive pattern part is not disposed;
- a first protection layer disposed on the first conductive pattern part;
- and
- a second protection layer disposed on the second conductive pattern part and the first dummy pattern part,
- wherein the first conductive pattern part at an outermost periphery of the substrate is covered by the first protection layer, and
- wherein the first dummy pattern part includes:
- a first wiring pattern layer, and
- a first plating layer including tin (Sn) disposed on the first wiring pattern layer.
A chip package which comprises a flexible circuit board, the flexible circuit board comprising:
- a substrate;
- a first conductive pattern part disposed on a first surface of the substrate;
- a second conductive pattern part disposed on a second surface opposite to the first surface of the substrate;
- a first dummy pattern part disposed in a region of the second surface of the substrate in which the second conductive pattern part is not disposed;
- a first protection layer disposed on the first conductive pattern part;
- a second protection layer disposed on the second conductive pattern part and the first dummy pattern part,
- a chip disposed on the first conductive pattern part or the second conductive pattern part,
- wherein the first conductive pattern part at an outermost periphery of the substrate is covered by the first protection layer, and
- wherein the first dummy pattern part includes:
- a first wiring pattern layer, and
- a first plating layer including tin (Sn) disposed on the first wiring pattern layer.
Dependencies are inferred from the claim text.