Microelectronic package with mold-integrated components

A microelectronic package assembly comprising:

• an overmold material;
• a redistribution layer (RDL) in the overmold material configured to provide electrical interconnection within the overmold material, wherein the RDL comprises at least one electrically conductive mold interconnect;
• a die in the overmold material electrically coupled with the RDL on an active side of the die;
• a through-mold via (TMV) disposed in the overmold material, wherein the TMV is electrically coupled with the RDL by the mold interconnect, and the TMV is a shield TMV configured to electromagnetically shield the die;
• and
• a circuit board electrically coupled with the RDL and the TMV.

A method of forming a microelectronic package, comprising:

• forming a first layer of overmold material;
• forming, in the first layer of the overmold material, a through-mold via (TMV) and a redistribution layer (RDL) configured to provide electrical interconnection within the overmold material, wherein the RDL comprises at least one conductive mold interconnect;
• positioning, on the first layer of the overmold material, an electronic element such that the electronic element is electrically coupled with the RDL;
• forming, on the first layer of the overmold material, a second layer of overmold material that at least partially surrounds the electronic element;
• and
• conductively connecting the TMV to an electromagnetic interference (EMI) shield such that the TMV is configured to provide electromagnetic shielding to the die when conductively connected to a ground connection.