Semiconductor package having an interposer and method of manufacturing semiconductor package

A semiconductor package, comprising:

• a package substrate;
• an interposer disposed on the package substrate;
• and
• first and second semiconductor devices each disposed on the interposer, wherein the first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by the interposer,
• wherein the interposer includes:
• a semiconductor substrate having a plurality of through electrodes penetrating therethrough;
• a wiring layer disposed on an upper surface of the semiconductor substrate and having, a plurality of wirings electrically connected to the plurality of through electrodes;
• first redistribution wiring pads disposed on the wiring layer and electrically connected to the plurality of wirings;
• first bonding pads disposed on the first redistribution wiring pads;
• an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the first bonding pads;
• second redistribution wiring pads disposed on a lower surface of the semiconductor substrate and electrically connected to the through electrodes;
• and
• second bonding pads disposed on the second redistribution wiring pads,
• wherein a diameter of each of the second bonding pads is at least three times as great as as diameter of each of the first bonding pads.