Circuit board and method for manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorJoo-Nyung Jang
Life of this patent
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Abstract
A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, a driving chip disposed on the board and between the first connection pads and the second connection pads, and a first adhesive layer disposed on the board and overlapping with an entirety of the first connection pads in a plan view. The second connection pads are spaced apart from the first connection pads in a second direction perpendicular to the first direction.
Claims7
A method for manufacturing a circuit board, the method comprising:
- forming first conductive pads spaced apart from each other and arranged in one direction and first conductive lines connected to the first conductive pads, respectively, on a board;
- forming an adhesive layer overlapping with an entirety of the first conductive pads, on the first conductive pads;
- and
- forming second conductive lines having a different material from a material of the first conductive lines, on the first conductive lines,
- wherein the first conductive pads and the first conductive lines are formed of a same material, and the second conductive lines do not overlap with the first conductive pads in a plan view.
Dependencies are inferred from the claim text.