Semiconductor device and semiconductor module using same

A semiconductor device comprising:

• a heat dissipation plate formed in a plate shape;
• a plurality of switching elements joined to one surface of the heat dissipation plate;
• a first terminal located apart from the heat dissipation plate and extending in a direction away from the heat dissipation plate, the first terminal being connected via first conductors to surfaces of the plurality of switching elements on a side opposite to the heat dissipation plate side;
• and
• a sealing member sealing the plurality of switching elements, the heat dissipation plate, and the first terminal, wherein
• a cutout is provided at an outer periphery of the heat dissipation plate,
• a part of the first terminal on the heat dissipation plate side overlaps a cut-out area at the cutout as seen in a direction perpendicular to the one surface of the heat dissipation plate, and
• a retracted portion retracted inward is formed at an outer periphery of another surface of the heat dissipation plate.