Multi-pitch leads
AssigneeTexas Instruments Incorporated
InventorsSreenivasan K. Koduri, Nazila Dadvand
Life of this patent
Estimating the term…
Abstract
In some examples, a system comprises a die having multiple electrical connectors extending from a surface of the die and a lead coupled to the multiple electrical connectors. The lead comprises a first conductive member; a first non-solder metal plating stacked on the first conductive member; an electroplated layer stacked on the first non-solder metal plating; a second non-solder metal plating stacked on the electroplated layer; and a second conductive member stacked on the second non-solder metal plating, the second conductive member being thinner than the first conductive member. The system also comprises a molding to at least partially encapsulate the die and the lead.
Claims17
A semiconductor package comprising:
- a die including a first set of electrical connectors, a second set of electrical connectors, and a third set of electrical connectors extending from a surface of the die, the first set and second set of electrical connectors arranged in adjacent rows;
- a first conductive member electrically connected to the first set of electrical connectors and a second conductive member electrically connected to the second set of electrical connectors;
- and
- a third conductive member electrically connected to the first conductive member, and a fourth conductive member electrically connected to the second conductive member.
A semiconductor package comprising:
- a die comprising multiple rows of electrical connectors;
- a first plurality of leads, each lead in the first plurality of leads coupled to a different row of electrical connectors;
- and
- a second plurality of leads positioned in a different plane than the first plurality of leads, a first lead in the second plurality of leads coupled to multiple, non-consecutive leads in the first plurality of leads with multiple non-solder metals, a second lead in the second plurality of leads coupled to other multiple, non-consecutive leads in the first plurality of leads with multiple non-solder metals,
- wherein the first and second leads in the second plurality of leads include a larger volume than the leads in the first plurality of leads.
Dependencies are inferred from the claim text.