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US 11,694,945 B2Granted
Lead frame package having conductive surfaces
AssigneeSilanna Asia Pte Ltd
InventorsAriel Tan, Ren Huei Tzeng
Life of this patent
Estimating the term…
Abstract
Disclosed is a device including a first finger of a plurality of lead fingers of a lead frame connected to a first flag. A second finger of the plurality of lead fingers of the lead frame is connected to a second flag. A semiconductor die is coupled to the lead frame. An encapsulant covers the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, and excludes the first flag and the second flag. The first flag and the second flag are separated and electrically isolated from one another by the encapsulant.
Claims20
A device comprising:
- a first finger of a plurality of lead fingers of a lead frame connected to a first flag;
- a second finger of the plurality of lead fingers of the lead frame connected to a second flag;
- a semiconductor die coupled to the lead frame;
- and
- an encapsulant covering the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, excluding the first flag and the second flag, wherein the first flag and the second flag are separated and electrically isolated from one another by the encapsulant.
2 more elements
A process comprising:
- forming a lead frame from a material, the lead frame comprising:
- a first finger of a plurality of lead fingers connected to a first flag;
- a second finger of the plurality of lead fingers connected to a second flag;
- coupling a semiconductor die to the lead frame;
- connecting the semiconductor die to the first flag and the second flag;
- and
- encapsulating the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, excluding the first flag and the second flag, with an encapsulant;
- wherein the first flag and the second flag are separated and electrically isolated from one another by the encapsulant.
5 more elements
Dependencies are inferred from the claim text.