Semiconductor device including heat dissipation structure and fabricating method of the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen
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Abstract
A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.
Claims20
A semiconductor device, comprising:
- a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die comprising a thermal enhancement pattern;
- and
- a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader comprising a flow channel and a cooling liquid in the flow channel, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern, wherein outer sidewalls of the heat spreader are substantially aligned with outer sidewalls of the insulating encapsulant.
A semiconductor device, comprising:
- a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die comprising a thermal enhancement pattern;
- and
- a heat dissipation structure comprising a first dissipation portion and a second dissipation portion disposed on opposite surfaces of the chip package, the first dissipation portion of the heat dissipation structure comprising a flow channel and a cooling liquid in the flow channel, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern, wherein outer sidewalls of the first dissipation portion are substantially aligned with outer sidewalls of the insulating encapsulant.
A fabricating method of a semiconductor device, comprising:
- providing a semiconductor die having a thermal enhancement pattern;
- laterally encapsulating the semiconductor die by an insulating encapsulant to form a chip package;
- and
- assembling a heat dissipation structure with the chip package to form a flow channel between the heat dissipation structure and the chip package such that outer sidewalls of the heat dissipation structure are substantially aligned with outer sidewalls of the insulating encapsulant.
Dependencies are inferred from the claim text.