Semiconductor die package with multi-lid structures and method for forming the same

A semiconductor die package, comprising:

• a package substrate having a first surface;
• an interposer substrate disposed over the first surface;
• a first semiconductor die and a second semiconductor die disposed over the interposer substrate;
• an underfill element disposed over the interposer substrate and surrounding the first and second semiconductor dies, wherein a portion of the underfill element is between the first semiconductor die and the second semiconductor die;
• a ring structure attached to the first surface of the package substrate and arranged along a periphery of the package substrate;
• and
• a lid structure including a first lid part and a second lid part, wherein the first lid part covers a first top surface of the first semiconductor die, the second lid part covers a second top surface of the second semiconductor die, and a gap is formed between the first lid part and the second lid part to expose the portion of the underfill element, wherein in plan view, the entire first lid part is located within a periphery of the first top surface of the first semiconductor die, and the entire second lid part is located within a periphery of the second top surface of the second semiconductor die.

A method for forming a semiconductor die package, comprising:

• disposing a first semiconductor die and a second semiconductor die over an interposer substrate;
• forming an underfill element over the interposer substrate to surround the first and second semiconductor dies, wherein a portion of the underfill element is between the first semiconductor die and the second semiconductor die;
• stacking the interposer substrate along with the first and second semiconductor dies and the underfill element over a package substrate;
• installing a ring structure on the package substrate and along a periphery of the package substrate;
• and
• attaching a first lid structure to a first top surface of the first semiconductor die and attaching a second lid structure to a second top surface of the second semiconductor die, wherein a gap is formed between the first lid structure and the second lid structure to expose the portion of the underfill element, wherein in plan view, the entire first lid structure is located within a periphery of the first top surface of the first semiconductor die, and the entire second lid structure is located within a periphery of the second top surface of the second semiconductor die.