Semiconductor package, integrated optical communication system

A semiconductor package comprising:

• a substrate;
• a semiconductor substrate integrated with a first die and bonded to the substrate;
• a second die disposed over and bonded to the semiconductor substrate, wherein the second die is electrically connected to the first die;
• a lid structure disposed on the package substrate, wherein the lid structure comprises a side portion surrounding the semiconductor substrate with the first die and the second die, a cover portion connecting the side portion and covering a top surface of the second die, and an opening extending through both the cover portion and the side portion;
• and
• a coupler bonded to the first die, wherein a portion of the coupler penetrates through and extends out of the lid structure through the opening.

An integrated optical communication system comprising:

• a substrate;
• a photonic integrated circuit die disposed on the substrate;
• an electronic integrated circuit die disposed over the substrate and electrically connected to the photonic integrated circuit die;
• an encapsulation material laterally encapsulating the electronic integrated circuit die;
• a lid structure disposed on the substrate, wherein the lid structure surrounds the photonic integrated circuit die and the electronic integrated circuit die and covers a top surface of the electronic integrated circuit die;
• and
• an optical coupler bonded to the photonic integrated circuit die, wherein an optical fiber portion of the optical coupler penetrates through and extends out of the lid structure;
• and
• a dam structure disposed on the first die and located between the optical coupler and the encapsulation material.