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US 11,694,938 B2Granted
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsMariko Ohara, Masatake Harada, Akira Goto
Life of this patent
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Abstract
A semiconductor device includes a case enclosing a region filled with a sealing material. The case is made of resin. An electrode is fixed to the case. A section, which is a part of the electrode, is provided with a cutout that allows a part of the resin making the case to be exposed to the region.
Claims6
A semiconductor device comprising a case enclosing a region filled with a sealing material, wherein
- the case is made of resin,
- an electrode is fixed to the case,
- the electrode has a section in contact with the region, the section being a part of the electrode,
- the sealing material is provided so that the sealing material at least covers the section,
- the section is provided with a cutout that allows a part of the resin making the case to be exposed to the region,
- the cutout extends up to a boundary between the section and the case,
- the cutout is configured so that a portion of the cutout closer to the boundary has a larger cross-sectional area,
- in a same cross-section, a top of the cutout has a different cross-sectional area from a bottom of the cutout,
- the section has an inner surface in contact with the cutout,
- a part of the inner surface of the section is a curved surface,
- a shape of the section is an elongated shape,
- in plan view, a shape of the cutout provided in the section is circular, and
- a diameter of the cutout, whose shape is circular, is shorter than a length of the section in a short length direction of the section.
10 more elements
Dependencies are inferred from the claim text.