Semiconductor wafer and method of probe testing
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. Seddon
Life of this patent
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Abstract
Implementations of methods of making a semiconductor device may include: providing a partial semiconductor wafer. The method may also include providing a wafer holder including a tape portion with one or more openings through the tape portion. The method may include mounting the partial semiconductor wafer over the one or more openings in the tape portion of the wafer holder and providing an electrical connection to the partial semiconductor wafer through the one or more openings in the tape portion during probe test.
Claims20
A method of probe testing a semiconductor wafer, comprising:
- providing a partial semiconductor wafer;
- providing a wafer holder including a support structure with a plurality of openings through the support structure;
- mounting the partial semiconductor wafer over the plurality of openings in the support structure of the wafer holder;
- and
- providing an electrical connection to the partial semiconductor wafer through the plurality of openings in the support structure during probe testing.
An apparatus for probe testing a semiconductor device, comprising:
- a semiconductor wafer;
- and
- a wafer holder including a support structure with one or more openings through the support structure;
- wherein the semiconductor wafer is mounted over the one or more openings in the support structure of the wafer holder;
- wherein the one or more openings in the support structure is configured to establish an electrical connection to the semiconductor wafer through the one or more openings in the support structure during probe testing;
- and
- wherein the support structure is substantially non-stretchable.
An apparatus for probe testing a semiconductor device, comprising:
- a wafer holder including a support structure with one or more openings through the support structure;
- wherein the wafer holder is configured to hold a semiconductor wafer over the one or more openings in the support structure of the wafer holder;
- wherein the one or more openings in the support structure is configured to establish an electrical connection to the semiconductor wafer through the one or more openings in the support structure during probe testing;
- and
- wherein the support structure is substantially non-stretchable.
Dependencies are inferred from the claim text.