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US 11,694,918 B2Granted
Method and device for wafer taping
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsPeng Chen, MingLiang Li, Jian Miao
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Abstract
A method for taping a wafer is disclosed. A wafer taping device comprising a wafer stage is provided. A wafer is mounted and secured on the wafer stage. A tape is delivered along a first direction over the wafer. The tape is forced into adhesion with a surface of the wafer in a non-contact manner. The tape is cut along a perimeter of the wafer.
Claims15
A method for taping a wafer, comprising:
- providing a wafer taping device comprising a wafer stage;
- mounting a wafer on the wafer stage;
- delivering a tape along a first direction over the wafer;
- forcing the tape into adhesion with a surface of the wafer in a non-contact manner, wherein said forcing the tape into adhesion with a surface of the wafer in a non-contact manner comprises disposing an air blade with a slot-shaped air outlet in the wafer taping device, wherein the air blade provides an air flow with adequate and stable air pressure to force the tape into adhesion with the surface of the wafer, wherein the air blade is rotated and positioned at a specific angle with respect to the surface of the wafer;
- and
- cutting the tape along a perimeter of the wafer.
3 more elements
Dependencies are inferred from the claim text.