Back to results
US 11,694,914 B2Granted
Systems for integrated decomposition and scanning of a semiconducting wafer
AssigneeElemental Scientific, Inc.
InventorsTyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
Life of this patent
Estimating the term…
Abstract
Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
Claims20
A method for decomposing and scanning a surface of a semiconducting wafer utilizing a nozzle comprising:
- spraying a decomposition fluid into a chamber body housing a semiconducting wafer to introduce the decomposition fluid onto a surface of the semiconducting wafer;
- positioning a nozzle above the surface of the semiconducting wafer following spraying the decomposition fluid into the chamber body;
- introducing a scan fluid to an inlet port of the nozzle and directing a stream of the scan fluid onto the surface of the semiconducting wafer;
- directing the stream of the scan fluid through an elongated channel of the nozzle along the surface of the semiconducting wafer toward one or more ends of the elongated channel of the nozzle;
- and
- removing the stream of the scan fluid from the surface of the semiconducting wafer via the nozzle.
3 more elements
A method for decomposing and scanning a surface of a semiconducting wafer utilizing a nozzle comprising:
- spraying a decomposition fluid into a chamber body housing a semiconducting wafer to introduce the decomposition fluid onto a surface of the semiconducting wafer;
- positioning a nozzle above the surface of the semiconducting wafer following spraying the decomposition fluid into the chamber body;
- introducing a scan fluid to the nozzle and directing a stream of the scan fluid onto the surface of the semiconducting wafer;
- directing the stream of the scan fluid through an elongated channel of the nozzle along the surface of the semiconducting wafer toward one or more ends of the elongated channel of the nozzle;
- and
- removing the stream of the scan fluid from the surface of the semiconducting wafer via the nozzle.
3 more elements
Dependencies are inferred from the claim text.