Substrate structure, and fabrication and packaging methods thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsXinru Zeng, Peng Chen, Houde Zhou
Life of this patent
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Abstract
A method for fabricating a substrate structure for packaging includes providing a core substrate, a plurality of conductive pads at a first surface of the core substrate, and a metal layer at a second surface of the core substrate opposite to the first surface; forming a conductive structure, for pasting the substrate structure onto an external component, on each of the plurality of conductive pads; forming a molding compound on the first surface of the core substrate and to encapsulate the conductive structure; and forming a plurality of packaging pads by patterning the metal layer at the second surface of the core substrate.
Claims18
A method for forming a substrate structure for packaging, comprising:
- providing a core substrate, a plurality of conductive pads at a first surface of the core substrate, and a metal layer at a second surface of the core substrate opposite to the first surface;
- forming a conductive structure, for pasting the substrate structure onto an external component, on each of the plurality of conductive pads;
- prior to forming a molding compound, attaching a semiconductor device to the first surface of the core substrate, wherein, in a direction perpendicular to and away from the first surface of the core substrate, a portion of the conductive structure exceeds a top surface of the semiconductor device;
- forming the molding compound on the first surface of the core substrate to embed the semiconductor device within the molding compound and to encapsulate the conductive structure;
- forming a plurality of packaging pads by patterning the metal layer at the second surface of the core substrate;
- and
- after forming the plurality of packaging pads, removing a portion of each conductive structure at the first surface with the semiconductor device embedded within the encapsulation layer.
A method for forming a substrate structure for packaging, comprising:
- providing a core substrate, a plurality of conductive pads at a first surface of the core substrate, and a metal layer at a second surface of the core substrate opposite to the first surface;
- forming a conductive structure, for pasting the substrate structure onto an external component, on each of the plurality of conductive pads;
- prior to forming a molding compound, attaching a semiconductor device to the first surface of the core substrate;
- forming the molding compound on the first surface of the core substrate to embed the semiconductor device within the molding compound and to encapsulate the conductive structure;
- and
- forming a plurality of packaging pads by patterning the metal layer at the second surface of the core substrate, wherein:
- the molding compound includes a plurality of molding compound portions, and adjacent molding compound portions are separated apart by a trench and are together on the first surface of the core substrate.
A substrate structure for packaging, comprising:
- a core substrate, a plurality of conductive pads at a first surface of the core substrate, and a plurality of packaging pads at a second surface of the core substrate opposite to the first surface;
- a conductive structure, for pasting the substrate structure onto an external component, on each of the plurality of conductive pads;
- a semiconductor device attached to the first surface of the core substrate;
- and
- a molding compound on the first surface of the core substrate and encapsulating the conductive structure, wherein the semiconductor device is embedded within the molding compound;
- a plurality of device-contact pads at the first surface of the core substrate;
- a first solder resist (SR) layer formed on the first surface of the core substrate, wherein the plurality of conductive pads is at least partially uncovered by the first SR layer, and the plurality of device-contact pad is at least partially uncovered by the first SR layer,
- wherein the semiconductor device is connected to at least one device-contact pad of the plurality of device-contact pads.
Dependencies are inferred from the claim text.