Area selective organic material removal
AssigneeASM IP Holding B.V.
InventorsMikko Ritala, Chao Zhang, Markku Leskelä
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Abstract
Aspects of this disclosure relate to selective removal of material of a layer, such as a carbon-containing layer. The layer can be over a patterned structure of two different materials. Treating the layer to cause the removal agent to be catalytically activated by a first area of the patterned structure to remove material of the organic material over the first area at a greater rate than over a second area of the patterned structure having a different composition from the first area.
Claims23
A method of selectively removing carbon-containing material from a substrate, the method comprising:
- providing a substrate in a reaction space, the substrate having a patterned structure thereon and a carbon-containing film over first and second areas of the patterned structure, wherein the patterned structure comprises a first material comprising a removal-enhancing material in the first area and a second material of a chemically different composition from the removal-enhancing material in the second area;
- and
- treating the substrate to cause the removal-enhancing material to enhance the removal of carbon-containing material from the first area of the substrate relative to the second area, wherein the patterned structure comprises a metal in the first area after said treating.
A method of selectively removing carbon-containing material from a substrate, the method comprising:
- providing a substrate in a reaction space, the substrate having a patterned structure thereon and a carbon-containing film over first and second areas of the patterned structure, wherein the patterned structure comprises a first material comprising a removal-enhancing material in the first area and a second material of a chemically different composition from the removal-enhancing material in the second area;
- treating the substrate to cause the removal-enhancing material to enhance removal of carbon-containing material from the first area of the substrate relative to the second area;
- and
- after treating the substrate, selectively depositing a target material over the first area such that the second area is substantially free from the deposition of the target material.
A method of selective organic material removal, the method comprising:
- providing, in a reaction space, a substrate having a patterned structure thereon and an organic film over first and second areas of the patterned structure, wherein the patterned structure comprises a first material comprising a catalytic material in the first area and a second material of a chemically different composition from the catalytic material in the second area;
- and
- exposing the organic film to a vapor phase reactant in the reaction space such that the vapor phase reactant is activated by the catalytic material of the patterned structure to remove a material of the organic film at a greater rate over the first area compared to a rate of removal of the material of the organic film from over the second area.
A method of selectively removing organic material from a substrate, the method comprising:
- providing a substrate in a reaction space, the substrate having a patterned structure thereon and a removable film over first and second areas of the patterned structure, wherein the patterned structure comprises a first material comprising a removal-enhancing material in the first area and a second material of a chemically different composition from the removal-enhancing material in the second area;
- and
- heating the substrate to cause the removal-enhancing material to enhance the removal of organic material from the first area of the substrate relative to the second area, wherein the patterned structure comprises a metal in the first area after said heating.
Dependencies are inferred from the claim text.