US 11,694,876 B2 · Apparatus and method for delivering a plurality of waveform signals during plasma processing

Abstract

Embodiments of the present disclosure generally relate to a system used in a semiconductor device manufacturing process. More specifically, embodiments provided herein generally include apparatus and methods for synchronizing and controlling the delivery of an RF bias voltage signal and a pulsed voltage waveform to one or more electrodes within a plasma processing chamber. Embodiments of the disclosure include a method and apparatus for synchronizing a pulsed radio frequency (RF) waveform to a pulsed voltage (PV) waveform, such that the pulsed RF waveform is on during a first stage of the PV waveform and off during a second stage. The first stage of the PV waveform includes a sheath collapse stage. The second stage of the PV waveform includes an ion current stage.

Claims26

Dependent claims

A method for plasma processing comprising:

applying a pulsed voltage waveform to one or more electrodes disposed in a substrate support, the pulsed voltage waveform comprising a series of voltage pulses that each comprise a first stage and a second stage;
applying a pulsed radio frequency (RF) waveform to the one or more electrodes to generate a plasma in a processing region of a processing chamber;
and
synchronizing the pulsed RF waveform with each pulse of the pulsed voltage waveform, such that an RF waveform of the pulsed RF waveform is provided only during at least a portion of the second stage of each pulse of the pulsed voltage waveform.

1 more element

Dependencies are inferred from the claim text.

Apparatus and method for delivering a plurality of waveform signals during plasma processing

Life of this patent

Apparatus and method for delivering a plurality of waveform signals during plasma processing

Life of this patent

Abstract

Claims26