Evaluating a contact between a wafer and an electrostatic chuck
AssigneeApplied Materials Israel Ltd.
InventorsAdam Faust, Yosef Basson, Guy Eytan, Yonathan David
Life of this patent
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AssigneeApplied Materials Israel Ltd.
InventorsAdam Faust, Yosef Basson, Guy Eytan, Yonathan David
Estimating the term…
A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.
A method for evaluating a contact between a wafer and an electrostatic chuck, the method comprising:
A device for evaluating a contact between a wafer and an electrostatic chuck, the device comprises:
A non-transitory computer readable medium for evaluating a contact between a wafer and an electrostatic chuck, the non-transitory computer readable medium stores instructions for:
Dependencies are inferred from the claim text.