Base configured as an electronic component or a circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorsNamiko Sasajima, Hiroki Imaeda, Masami Okado, Shinji Otani, Tomohiro Sunaga, Yoshimasa Yoshioka
Life of this patent
Estimating the term…
Abstract
A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.
Claims20
A base, comprising:
- a main body;
- and
- a multilayer metal film disposed on the main body,
- the multilayer metal film including:
- a first metal film disposed on the main body, the first metal film having conductivity;
- a second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching;
- and
- a third metal film on the second metal film, the third metal film having wettability and including an inwardly extended portion extending between the second metal film and the main body,
- wherein first, second, and third surfaces of the inwardly extending portion are in direct contact with the main body, the first metal film, and the second metal film, respectively, without any intervening layer.
Dependencies are inferred from the claim text.