Systems and methods of fabricating coils for coreless transformers and inductors
AssigneeNano Dimension Technologies, Ltd.
InventorMinoru Yamada
Life of this patent
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Abstract
The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.
Claims14
A method of fabricating a coreless printed circuit board (PCB)-based transformer (cPCBT) comprising at least one primary winding element and one secondary winding element, said cPCBT having a windings' turn ratio of the primary winding element to the secondary winding element operable to achieve a step-up/down-operation, the method comprising:
- providing an ink jet printing system having:
- a first print head adapted to dispense a dielectric ink;
- a second print head adapted to dispense a conductive ink;
- a conveyor, operably coupled to the first and second print heads, configured to convey a substrate to each print heads;
- and
- a computer aided manufacturing (“CAM”) module, in communication with each of the first, and second print heads, the CAM further comprising a central processing module (CPM) including at least one processor, in communication with a non-transitory computer readable storage device operable to store instructions that, when executed by the at least one processor cause the CAM to control the ink-jet printing system, by carrying out steps that comprise:
- receiving a 3D visualization file representing the cPCBT;
- and
- generating a file library having a plurality of ordered files, each ordered file representing a substantially 2D layer for printing the cPCBT having thereon:
- at least one of:
- a conductive pattern;
- and a dielectric pattern, and a metafile representing at least the printing order;
- providing the dielectric inkjet ink composition, and the conductive inkjet ink composition;
- using the CAM module, obtaining a first ordered layer file for printing;
- using the first print head, forming the pattern corresponding to the dielectric inkjet ink of the first ordered layer file on the substrate;
- using actinic radiation, curing the dielectric pattern;
- using the second print head, forming the conductive pattern in the first ordered file for printing of cPCBT;
- using heat, sintering the pattern corresponding to the conductive inkjet ink in the first ordered layer file, wherein the steps of curing and sintering are carried out separately;
- using the CAM module, obtaining from the library an ordered layer file representative of a subsequent layer for printing the cPCBT;
- using the first print head, forming the pattern corresponding to the dielectric ink in the subsequent ordered layer file;
- using actinic radiation, curing the dielectric pattern in the subsequent ordered layer file;
- using the second print head, forming the conductive pattern in the subsequent ordered layer file for printing of cPCBT;
- using heat, sintering the conductive pattern in the subsequent ordered layer file;
- and
- repeating the steps of, obtaining from the library an ordered layer file representative of a subsequent layer for printing the cPCBT—to the step of sintering the conductive pattern in the subsequent ordered layer file, wherein a final conductive layer is printed, thereby forming the cPCBT, with a windings' turn ratio of a primary winding element to a secondary winding element that is operable to achieve a step-up/down-operation, and wherein each of the primary winding element and the secondary winding element of the windings is comprised of a plurality of sub-element arcs of predetermined radians concatenated to a subsequent sub-element arc with at least one of:
- a blind via, and a buried via each formed in the steps of printing the first, the subsequent, or the final conductive pattern.
Dependencies are inferred from the claim text.