On-chip multi-layer transformer and inductor
AssigneeIntel Corporation
InventorsChuanzhao Yu, Qiang Li, David Newman
Life of this patent
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Abstract
A stacked transformer or inductor apparatus including a first layer with a first layer wire element extending around a center axis and a second layer with a second layer wire element. The second layer element includes side by side first and second wire components in parallel spaced relation extending around the center axis and the first wire component is connected to the first layer wire element to form a primary turn winding. A third layer includes a third layer wire element extending around the center axis and connected to the second wire component of the second layer wire element to form a secondary turn winding partially overlapping with the primary turn winding.
Claims19
A stacked inductance apparatus, comprising:
- a first winding comprising a first wire section and a second wire section, the first wire section and the second wire section are disposed parallel to each other in a first horizontal plane associated with a center axis, and the first winding associated with an equivalent current flow path within the first horizontal plane;
- a second winding, the second winding associated with a current flow path, the second winding positioned in the first horizontal plane between the first wire section and the second wire section to align the equivalent current flow path of the first winding with the current flow path of the second winding;
- and
- at least one wire section, the at least one wire section extending from the second winding and disposed on a second horizontal plane, the second horizontal plane being parallel to the first horizontal plane.
A method of manufacturing an inductance apparatus, comprising:
- stacking wire elements above a substrate to form stacked wire elements;
- connecting a first wire section of a shared wire element to the stacked wire elements to form a first winding, the shared wire element including the first wire section and a second wire section disposed in a parallel spaced relation within a first horizontal plane;
- and
- connecting the second wire section of the shared wire element to a secondary wire element of the stacked wire elements to form a second winding such that the secondary wire element is in a second horizontal plane, partially overlaps the first winding, and fully overlaps the second winding.
A method of manufacturing an inductance apparatus, comprising:
- stacking wire elements on a substrate to form stacked wire elements;
- placing a first winding on the stacked wire elements, the first winding including a first wire section and a second wire section in a parallel spaced relation within a horizontal plane;
- and
- placing a second winding on the stacked wire elements between the first and second wire sections within the horizontal plane to vertically align an equivalent current flow of the first winding with a current flow of the second winding.
Dependencies are inferred from the claim text.