Head suspension assembly and disk device

Abstract

A head suspension assembly includes a support plate, a wiring member on the support plate, a head mounted on the wiring member and electrically connected to the wiring member, and a piezoelectric element mounted on the wiring member. The piezoelectric element has first and second electrodes electrically connected to the wiring member. The wiring member includes a metal layer, a base insulating layer, a conductive layer, and a cover insulating layer stacked in order. The cover insulating layer includes a pad opening through which the first electrode is connected to the conductive layer with a conducive adhesive therebetween. The base insulating layer includes a first region below the first pad opening and a second region below a side surface of the piezoelectric element. A thickness of the base insulating layer in the second region is less than a thickness of the base insulating layer in the first region.

Dependencies are inferred from the claim text.