Stacked semiconductor device assembly in computer system

A stacked semiconductor device assembly, comprising:

• a plurality of stacked semiconductor devices, each semiconductor device further comprising:
• a signal path;
• first IC coupled to the signal path and including a first output driver and electrostatic discharge protection (ESD) circuitry;
• second IC coupled to the signal path and including a second output driver;
• and
• selection circuitry coupled to and distinct from both of the first IC and second IC, where the selection circuitry is configured to select one of the first IC or the second IC to control whether the IC chip communicates data via the signal path with local ESD protection.

A method for assembling a semiconductor device, comprising:

• providing a plurality of semiconductor devices, each semiconductor device further comprising:
• a signal path;
• first IC coupled to the signal path and including a first output driver and electrostatic discharge protection (ESD) circuitry;
• second IC coupled to the signal path and including a second output driver;
• and
• selection circuitry coupled to and distinct from both of the first IC and second IC, where the selection circuitry is configured to select one of the first IC or the second IC to control whether the IC chip communicates data via the signal path with local ESD protection;
• and
• stacking the plurality of semiconductor devices.