Vapour chamber

An apparatus comprising:

• at least a first vapour chamber portion comprising a first wall and a second vapour chamber portion comprising a second wall, wherein the first vapour chamber portion houses a first internal volume and the second vapour chamber portion houses a second internal volume, where the first wall is in contact with the second wall, and where the first internal volume is configured to enable heat flow across the first wall and across the second wall and to the second internal volume;
• at least one hinge formed from the first wall and the second wall and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion;
• and
• wherein the hinge is thermally conductive and configured to transfer heat from the first vapour chamber portion to the second vapour chamber portion;
• wherein the first vapour chamber portion is configured so that a first working fluid condenses on the area of the first wall that forms the hinge and the second vapour chamber portion is configured so that a second working fluid evaporates from the area of the second wall that forms the hinge.