Substrate processing method, substrate processing apparatus, and storage medium
AssigneeTokyo Electron Limited
InventorsKeiichi Tanaka, Kosuke Yoshihara, Yoshihiro Kondo, Makoto Muramatsu, Teruhiko Kodama
Life of this patent
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Abstract
A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.
Claims19
A method of processing a substrate, the method comprising:
- emitting light including vacuum ultraviolet light from a light source to a front surface of the substrate, wherein the substrate has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container,
- wherein the light including the vacuum ultraviolet light is emitted to the front surface of the substrate through a light adjustment member disposed between the light source and the front surface of the substrate, and
- wherein an intensity proportion of a first wavelength range constituting an intensity peak of the light after being passed through the light adjustment member is smaller than that of the light before being passed through the light adjustment member, and an intensity proportion of a second wavelength range different from the first wavelength range of the light after being passed through the light adjustment member is larger than that of the light before being passed through the light adjustment member.
A non-transitory computer-readable storage medium storing a program, wherein the storage medium is configured to cause an apparatus to emitting a light including vacuum ultraviolet light from a light source to a front surface of a substrate, wherein the substrate has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container,
- wherein the light including the vacuum ultraviolet light is emitted to the front surface of the substrate through a light adjustment member disposed between the light source and the front surface of the substrate, and
- wherein an intensity proportion of a first wavelength range constituting an intensity peak of the light after being passed through the light adjustment member is smaller than that of the light before being passed through the light adjustment member, and an intensity proportion of a second wavelength range different from the first wavelength range of the light after being passed through the light adjustment member is larger than that of the light before being passed through the light adjustment member.
A substrate processing apparatus comprising:
- a processing container;
- a light source configured to emit light including vacuum ultraviolet light to a substrate, which has a resist film formed thereon from a resist material for EUV lithography, in an interior of the processing container;
- a controller configured to control the light source to emit the light including the vacuum ultraviolet light before an exposure process for the substrate;
- and
- a light adjustment member disposed between the light source and a front surface of the substrate,
- wherein the light including the vacuum ultraviolet light is emitted to the front surface of the substrate through the light adjustment member, and
- wherein an intensity proportion of a first wavelength range constituting an intensity peak of the light after being passed through the light adjustment member is smaller than that of the light before being passed through the light adjustment member, and an intensity proportion of a second wavelength range different from the first wavelength range of the light after being passed through the light adjustment member is larger than that of the light before being passed through the light adjustment member.
Dependencies are inferred from the claim text.