Molded range and proximity sensor with optical resin lens
AssigneesSTMicroelectronics (Research & Development) Limited, Stmicroelectronics Pte Ltd
InventorsWing Shenq Wong, Andy Price, Eric Christison
Life of this patent
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Abstract
A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
Claims20
A structure, comprising:
- a semiconductor die having a first surface and a second surface;
- a light sensor in the semiconductor die and between the first surface and the second surface;
- a light emitting device on the first surface of the semiconductor die;
- a glue stopper element on the first surface and between the light emitting device and the light sensor;
- a first resin lens that encapsulates the light emitting device on the first surface;
- a second resin lens that encapsulates the light sensor on the first surface;
- and
- a molding compound surrounds the first resin lens, surrounds the second resin lens, is on the glue stopper element, and is on the semiconductor die.
A device, comprising:
- a substrate having a plurality of conductive contact leads;
- an encapsulation layer over the substrate, the plurality of conductive contact leads exposed from the encapsulation layer;
- and
- a plurality of structures in the encapsulation layer and coupled to one or more conductive contact leads of the plurality of conductive contact leads, the plurality of structures including:
- a semiconductor die including a light sensor in the semiconductor die;
- a light emitting device on a surface of the semiconductor die;
- and
- a glue stopper element on the surface of the semiconductor die and between the light emitting device and the light sensor.
A method, comprising:
- mounting a light emitting device on a first surface of a semiconductor die, the semiconductor die having a light receiving sensor on the first surface laterally with respect to the light emitting device;
- forming a glue stopper element on the first surface and between the light emitting device and the light receiving sensor;
- after the forming the glue stopper element, forming a first optical resin overlying the light emitting device;
- and
- after the forming the glue stopper element, forming a second optical resin overlying the light receiving sensor.
Dependencies are inferred from the claim text.