Semiconductor inspecting method
OwnerVolker Hansel, Sebastian Giessmann +2inventors
InventorsVolker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
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Abstract
The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
Claims5
A semiconductor inspecting method, comprising multiple steps of:
- (a) defining a first position of a probe needle in a image from above by adopting a vision system of a semiconductor inspecting system;
- (b) making a first relative vertical movement between the probe needle and the pad by adopting a driving system of the semiconductor inspecting system;
- (c) recognizing whether the probe needle corresponding to the first position in the image has a minimum change in position due to the first relative vertical movement by adopting the vision system of the semiconductor inspecting system;
- and
- (d) once the minimum change in position of the probe needle caused by the probe needle being contacted with the pads is recognized, stopping the first relative vertical movement by adopting the driving system of the semiconductor inspecting system;
- wherein the step (c) further comprises multiple steps of:
- (c1) obtaining a second position of the probe needle in the image by adopting the vision system;
- and
- (c2) comparing the second position with the first position to recognize whether the probe needle is contacted with the pad or not;
- wherein the second position is defined as a position of the probe needle on the pad in the image after the first relative vertical movement and the probe needle being contacted with the pad to generate the minimum change in position of the probe needle.
Dependencies are inferred from the claim text.