Sensor test apparatus
AssigneeAdvantest Corporation
InventorsKazunari Suga, Daisuke Takano, Satoshi Hanamura, Michiro Chiba, Hisao Nishizaki, Atsushi Hayakawa
Life of this patent
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Abstract
A sensor test apparatus capable of efficiently testing a sensor is provided. A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.
Claims13
A sensor test apparatus for testing a sensor that includes an individualized die and that detects a first physical quantity, the sensor test apparatus comprising:
- an application unit comprising a plurality of application devices, each of the application devices including:
- a socket to which the sensor is electrically connected,
- a first application part that applies the first physical quantity to the sensor,
- a second application part that applies a second physical quantity to the sensor, the second physical quantity being different from the first physical quantity, and
- a pusher that contacts the sensor and presses the sensor against the socket;
- a test unit that tests the sensor via the socket based on a signal output from the sensor, the signal corresponding to the first physical quantity detected by the sensor;
- and
- a conveying device that conveys the sensor into and out of the application unit, wherein
- the second application part is a temperature adjustment part that applies a thermal stress as the second physical quantity to the sensor to adjust the temperature of the sensor,
- the conveying device conveys the sensor toward the socket from above the socket and places the sensor on the socket, and
- the pusher presses the sensor against the socket downwardly to electrically connect the sensor to the socket for testing the sensor including the individualized die after the conveying device releases the sensor.
A sensor test apparatus for testing a sensor that detects a first physical quantity, the sensor test apparatus comprising:
- an application unit comprising at least one application device, the application device including:
- a socket to which the sensor is electrically connected,
- a first application part that applies the first physical quantity to the sensor, and
- a second application part that applies a second physical quantity to the sensor, the second physical quantity being different from the first physical quantity;
- a test unit that tests the sensor via the socket;
- and
- a conveying device that conveys the sensor into and out of the application unit, wherein
- the sensor test apparatus comprises an apparatus main body housing the application unit, the test unit, and the conveying device,
- the apparatus main body has:
- a first opening through which the sensor is fed to a first position in the sensor test apparatus, and
- a second opening through which the sensor is ejected from a second position in the sensor test apparatus, and
- the conveying device moves an untested sensor from the first position to the application unit and moves a tested sensor from the application unit to the second position,
- the sensor test apparatus comprises:
- a preheat part that is disposed between the first position and the application unit and that applies a thermal stress to the sensor before being conveyed into the application unit;
- and
- a heat removal part that is disposed between the application unit and the second position and that removes a thermal stress from the sensor after being conveyed out of the application unit;
- and
- the conveying device moves the untested sensor from the first position to the preheat part, moves the untested sensor from the preheat part to the application unit, moves the tested sensor from the application unit to the heat removal part, and moves the tested sensor from the heat removal part to the second position.
Dependencies are inferred from the claim text.