Cryogenic wafer test system

A method for testing a plurality of superconducting die on a wafer device-under-test (DUT) via a cryogenic wafer test system, the method comprising:

• securing the wafer DUT on a wafer chuck in a first chamber of the cryogenic wafer test system;
• cooling the first chamber to a cryogenic temperature;
• facilitating at least one of translational and rotational motion of the wafer chuck via a wafer chuck actuator system confined within a second chamber of the cryogenic wafer test system to facilitate alignment and contact of a plurality of electrical contacts of a superconducting die of the plurality of superconducting die to a respective plurality of electrical probe contacts of a plurality of prober arms that are confined within the first chamber, the plurality of prober arms including a wedge-shaped distal probe portion having electrical lines extending from a first surface around a periphery of the wedge-shape distal portion to the plurality of electrical probe contacts on a second surface, the first surface and the second surface being opposing surfaces of the plurality of prober arms;
• and
• implementing a test of the respective superconducting die via the plurality of prober arms.

A cryogenic wafer test system comprising:

• a first chamber that is cooled to a cryogenic temperature in a vacuum;
• a wafer chuck confined within the first chamber, the wafer chuck being configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die;
• a plurality of prober arms configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts, the plurality of prober arms including a wedge-shaped distal probe portion having a plurality of electrical lines extending from a first surface around a periphery of the wedge-shape distal portion to a plurality of electrical probe contacts on a second surface, the first surface and the second surface being opposing surfaces of the plurality of prober arms;
• and
• a wafer chuck actuator system confined within a second chamber in a vacuum at a non-cryogenic temperature, the wafer chuck actuator system being configured to provide translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts on each of the plurality of prober arms.

A method for testing a plurality of superconducting die on a wafer device-under-test (DUT) via a cryogenic wafer test system, the method comprising:

• securing the wafer DUT on a wafer chuck in a first chamber of the cryogenic wafer test system;
• cooling the first chamber to a cryogenic temperature;
• facilitating at least one of translational and rotational motion of the wafer chuck via a wafer chuck actuator system confined within a second chamber of the cryogenic wafer test system to facilitate alignment and contact of a plurality of electrical contacts of a superconducting die of the plurality of superconducting die to a respective plurality of electrical probe contacts of a probe card that is confined within the first chamber, the probe card including at least one through-hole that extends from a first surface to an opposite second surface to facilitate alignment of the plurality of electrical contacts on of the superconducting die to the respective plurality of electrical probe contacts on the opposing second surface of the probe card, the probe card including a plurality of electrical lines that extend from the first surface through the at least one through-hole and connect the respective plurality of electrical probe contacts on the second surface of the probe card;
• and
• implementing a test of the respective superconducting die via the probe card.