Die bonding apparatus and manufacturing method for semiconductor device

A die bonding apparatus comprising:

• a photographing device for photographing a die;
• a first illumination device for irradiating the die with light along an optical axis of the photographing device;
• a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis;
• and
• a control device for controlling the photographing device, the first illumination device, and the second illumination device,
• wherein the first illumination device includes a first light emitting section having a plane light emitting source, and a semi-transmissive mirror that irradiates a top surface of the die with first irradiation light emitted from the first light emitting section in a cylinder of its own,
• the second illumination device includes a second light emitting section, and the second illumination device is disposed in such a way that second irradiation light emitted from the second light emitting section passes through the cylinder and the top surface of the die is irradiated with the second irradiation light,
• the first illumination device further includes a light shielding section that shields some of the second irradiation light emitted from the second light emitting section or a first light path control member that limits a light path of the second irradiation light emitted from the second light emitting section, and
• the control device is configured, in the case where cracks of the die are checked, in such a way that the control device turns off the first illumination device, and turns on the second illumination device, and the top surface of the die is irradiated with the second irradiation light from the second illumination device.

A die bonding apparatus comprising:

• a photographing device for photographing a die;
• a first illumination device for irradiating the die with light along an optical axis of the photographing device;
• a second illumination device that is located above a lower end of the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis;
• and
• a control device for controlling the photographing device, the first illumination device, and the second illumination device,
• wherein the first illumination device includes a lens, a first light emitting section having a plane light emitting source, and a semi-transmissive mirror that irradiates the top surface of the die with first irradiation light emitted from the first light emitting section in the cylinder of its own,
• the second illumination device includes a second light emitting section, and the second illumination device is disposed in such a way that second irradiation light, emitted from the second light emitting section does not pass through the cylinder and the top surface of the die is irradiated with the second irradiation light, and
• the control device is configured, in the case where cracks of the die are checked, in such a way that the control device turns off the first illumination device, and turns on the second illumination device, and the top surface of the die is irradiated with the second irradiation light from the second illumination device.