Method for aligning to a pattern on a wafer
AssigneeUnited Semiconductor (Xiamen) Co., Ltd.
InventorsDian Han Liu, Maohua Ren, Yuan-Chi Pai, Wen Yi Tan
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Abstract
A method for aligning to a pattern on a wafer is disclosed. The method includes the steps of obtaining a first inline image from a first sample wafer, obtaining a first contour pattern of an alignment mark pattern from the first inline image, using the first contour pattern to generate a first synthetic image in black and white pixels, using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer, and aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.
Claims16
A method for aligning to a pattern on a wafer, comprising:
- obtaining a first inline image from a first sample wafer and a second inline image from a second sample wafer;
- obtaining a first contour pattern of an alignment mark pattern from the first inline image and a second contour pattern of the alignment mark pattern from the second inline image;
- using the first contour pattern and the second contour pattern to generate a first synthetic image in black and white pixels;
- using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer;
- and
- aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.
A method for aligning to a pattern on a wafer, comprising:
- obtaining a plurality of first inline images from a plurality of first sample wafers and a second inline image from a second sample wafer;
- obtaining a first contour pattern of an alignment mark pattern from the plurality of first inline images and a second contour pattern of the alignment mark pattern from the second inline image;
- using the first contour pattern and the second contour pattern to generate a first synthetic image in black and white pixels;
- using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer;
- and
- aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.
Dependencies are inferred from the claim text.