MEMS pressure sensor and method for forming the same
AssigneeMemsen Electronics Inc
InventorManhing Chau
Life of this patent
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Abstract
Provided are a MEMS pressure sensor and a method for forming the same. The method includes: preparing a first substrate including a first surface and a second surface opposite to each other; preparing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface and the third surface with each other and forming a cavity between the first substrate and the pressure sensing region of the second substrate; thinning the second substrate from the fourth surface by partially removing the second base, to form a fifth surface opposite to the third surface; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer.
Claims20
A method for forming a Micro-Electro Mechanical System (MEMS) pressure sensor, comprising:
- preparing a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to the first surface, and the first substrate comprises one or more conductive layers arranged on the side of the first surface of the first substrate;
- preparing a second substrate, wherein the second substrate comprises a third surface and a fourth surface opposite to the third surface, the second substrate comprises a second base and a pressure-sensing electrode arranged on or above the second base, the second substrate comprises a pressure sensing region in which the pressure-sensing electrode is arranged, and the pressure-sensing electrode is arranged on the side of the third surface of the second substrate;
- bonding the first surface of the first substrate and the third surface of the second substrate with each other and form a substrate bonding interface;
- forming a cavity between the first substrate and the pressure sensing region of the second substrate;
- removing the second base to form a fifth surface opposite to the third surface of the second substrate;
- and
- forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to at least one of the conductive layers, wherein the first conductive plug is used to electrically connect the conductive layer to the pressure-sensing electrode.
A Micro-Electro Mechanical System (MEMS) pressure sensor, comprising:
- a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to the first substrate, and the first substrate comprises one or more conductive layers arranged on the side of the first surface of the first substrate;
- a second substrate, wherein the second substrate comprises a third surface and a fifth surface opposite to the third surface, the second substrate comprises a pressure-sensing electrode, and the second substrate comprises a pressure sensing region in which the pressure-sensing electrode is arranged, and the pressure-sensing electrode is arranged on a side of the third surface of the second substrate;
- a substrate bonding interface formed by bonding the first surface of the first substrate and the third surface of the second substrate;
- a cavity formed between the first substrate and the pressure sensing region of the second substrate;
- and
- a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to at least one of the conductive layers, wherein the first conductive plug is used to electrically connect the conductive layer to the pressure-sensing electrode.
Dependencies are inferred from the claim text.