Mounting and use of piezoelectric cooling systems in devices
AssigneeFrore Systems Inc.
InventorsPrabhu Sathyamurthy, Suryaprakash Ganti, Seshagiri Rao Madhavapeddy, Lumaya Ahmed, Shekhar Halakatti
Life of this patent
Estimating the term…
Abstract
A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.
Claims17
A cooling system, comprising:
- a heat spreader in thermal communication with a heat-generating structure mounted on a substrate, the heat spreader over hanging the heat-generating structure;
- an active cooling element in thermal communication with the heat spreader, the active cooling element being in an active cooling system, the active cooling system also including a top plate and an orifice plate, the top plate including at least one vent therein corresponding to the active cooling element, the orifice plate including at least one orifice corresponding to the active cooling element, the active cooling element being between the top plate and the orifice plate, wherein vibrational motion of the active cooling element draws a fluid in through the at least one vent of the top plate and out through the at least one orifice in the orifice plate toward the heat spreader;
- and
- a base supporting the heat spreader and transferring a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees;
- wherein the base has an aperture therein, the aperture being aligned with the heat-generating structure such that the base is not interposed between the heat spreader and the heat-generating structure;
- and
- wherein the active cooling system and the heat spreader have a combined thickness of not more than three millimeters.
A system, comprising:
- a heat spreader in thermal communication with a heat-generating structure mounted on a substrate, the heat spreader over hanging the heat-generating structure and having a heat spreader thickness not exceeding six hundred micrometers;
- an active cooling system including a plurality of active cooling cells, each of the plurality of active cooling cells including an active cooling element, the active cooling system being in thermal communication with the heat spreader, wherein the active cooling element undergoes vibrational motion when actuated to drive a fluid toward the heat spreader, a combined thickness of the heat spreader and the active cooling system not exceeding four millimeters;
- and
- a base supporting the heat spreader and transferring a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees;
- wherein the base has an aperture therein, the aperture being aligned with the heat-generating structure such that the base is not interposed between the heat spreader and the heat-generating structure.
A method, comprising:
- driving a cooling element to induce a vibrational motion at a frequency, the cooling element being in a cooling system, the cooling system also including a top plate and an orifice plate, the top plate including at least one vent therein corresponding to the cooling element, the orifice plate including at least one orifice corresponding to the cooling element, the cooling element being between the top plate and the orifice plate, the vibrational motion driving a fluid in through the at least one vent in the top plate and out through the at least one orifice in the orifice plate, toward a heat spreader in thermal communication with a heat-generating structure mounted on a substrate, the heat spreader over hanging the heat-generating structure;
- and
- wherein a base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees;
- wherein the base has an aperture therein, the aperture being aligned with the heat-generating structure such that the base is not interposed between the heat spreader and the heat-generating structure;
- wherein the cooling system and the heat spreader have a combined thickness of not more than three millimeters.
Dependencies are inferred from the claim text.