Immersion cooling with water-based fluid using nano-structured coating
AssigneeThe Board of Trustees of the University of Illinois
InventorsNenad Miljkovic, Thomas Foulkes, Patrick Birbarah, Tarek Gebrael, Andrew Stillwell, Robert Pilawa-Podgurski
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Abstract
A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.
Claims9
A method comprising:
- coating, via chemical vapor deposition, one or more power electronic components disposed on a printed circuit board (PCB) with an electrical insulation coating of between two to 25 microns in thickness, the electrical insulation coating covering an outside and top portion of the one or more power electronic components relative to the PCB;
- depositing, on the electrical insulation coating, a nano-layer comprising a porous metal-based nano-structure;
- and
- after the coating and the depositing, immersing the PCB in a water-based fluid to cool the one or more power electronic components while the one or more power electronic components are powered on and from the outside and top portion of the one or more power electronic components.
Dependencies are inferred from the claim text.