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US 11,692,262 B2Granted
EM source for enhanced plasma control
AssigneeApplied Materials, Inc.
InventorsAlexander Jansen, Keith A. Miller, Prashanth Kothnur, Martin Riker, David Gunther, Emily Schooley
Life of this patent
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Abstract
Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.
Claims18
A plasma cathode assembly comprising:
- a cathode housing having a top, sidewalls and a backing plate enclosing an interior volume with a center axis, the backing plate configured to support a target during a sputtering process;
- a first EM coil inside the interior volume of the cathode housing, the first EM coil having a first inner diameter and a first outer diameter defining a first coil width, and a first bottom surface and a first top surface defining a first coil thickness, the center axis within the first inner diameter;
- and
- a second EM coil inside the interior volume of the cathode housing, the second EM coil having a second inner diameter and a second outer diameter defining a second coil width and a second bottom surface and a second top surface defining a second coil thickness, the first EM coil within the second inner diameter, wherein the first EM coil and the second EM coil are not positioned concentrically.
1 more element
A plasma processing chamber comprising:
- a chamber body comprising a bottom, sidewalls and a ceiling enclosing a process volume;
- a substrate support positioned within the process volume;
- and
- a plasma cathode assembly positioned above the substrate support, the plasma cathode assembly comprising:
- a cathode housing having a top, sidewalls and a backing plate enclosing an interior volume with a center axis, the backing plate configured to support a target;
- a first EM coil inside the interior volume of the cathode housing, the first EM coil having a first inner diameter and a first outer diameter defining a first coil width, the center axis within the first inner diameter;
- and
- a second EM coil inside the interior volume of the cathode housing, the second EM coil having a second inner diameter and a second outer diameter defining a second coil width, the first EM coil within the second inner diameter, wherein the first EM coil and the second EM coil are not positioned concentrically.
5 more elements
A method of tuning a plasma profile, the method comprising
- controlling spacing of EM coils within a plasma cathode assembly by flowing current through non-adjacent coils and not flowing current through intervening coils.
Dependencies are inferred from the claim text.