Back to results
US 11,692,137 B2Granted
Intermediate raw material, and polishing composition and composition for surface treatment using the same
AssigneeFujimi Incorporated
InventorsTsutomu Yoshino, Ayano Yamazaki, Satoru Yarita, Shogo Onishi, Yasuto Ishida
Life of this patent
Estimating the term…
Abstract
An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
Claims6
A polishing composition for polishing an object to be polished, the polishing composition comprising:
- a charge control agent having a critical packing parameter of 0.6 or more, wherein the charge control agent is at least one selected from the group consisting of:
- dilauryl hydrogen phosphite, 2-ethylhexyl acid phosphate, polyoxyethylene (n=3) styrenated phenyl ether ammonium sulfate, polyoxyethylene (n=5) styrenated phenyl ether ammonium sulfate, polyoxyethylene (n=7) styrenated phenyl ether ammonium sulfate, polyoxyethylene (n=12) styrenated phenyl ether ammonium sulfate;
- a dispersing medium;
- and
- abrasive grains, wherein:
- pH of the polishing composition is less than 7;
- and
- the abrasive grains are amino group modified abrasive grains and have a surface that is positively charged.
5 more elements
Dependencies are inferred from the claim text.