Filament compositions for fused filament fabrication and methods of use thereof

A filament comprising a polymer composition, said polymer composition consisting of:

• A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point;
• wherein said semi-aromatic copolyamide consists of
• a-1) 5 to 40 mole percent aromatic repeat units derived from:
• i) terephthalic acid and hexamethylenediamine;
• and
• a-2) 60 to 95 mole percent aliphatic repeat units derived from:
• ii) adipic acid, decanedioic acid, dodecanedioic acid, tetradecanedioic acid, hexadecanedioic acid, or octadecanedioic acid and hexamethylenediamine;
• B) 5 to 45 weight percent amorphous copolyamide having a melting point;
• wherein said amorphous copolyamide comprises
• b-1) 60 to 90 mole percent aromatic repeat units derived from:
• iii) isophthalic acid and an aliphatic diamine with 4 to 20 carbon atoms;
• and
• b-2) 10 to 40 mole percent aromatic repeat units derived from:
• iv) terephthalic acid and an aliphatic diamine with 4 to 20 carbon atoms;
• and optionally
• C) one or more additives selected from the group consisting of plasticizers, colorants, lubricants, antioxidants, and heat stabilizers;
• wherein
• the weight percentages are based on the sum of the weights of the semi-aromatic copolyamide and the amorphous copolyamide;
• and
• the mole percentages are based on the total number of moles of repeat units in the semi-aromatic copolyamide or in the amorphous copolyamide.