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US 11,691,869 B2Granted
Electronic apparatus including semiconductor package
AssigneeDenso Corporation
InventorsSuguru Hochi, Hideki Terasawa, Shigeki Sakurai
Life of this patent
Estimating the term…
Abstract
An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.
Claims7
An electronic apparatus comprising:
- a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, an island on which the sensor unit is mounted, a lead frame having a plurality of leads and a sealing resin that covers a part of the lead frame and the sensor unit;
- and
- a mounting member including a substrate having a front surface that faces the semiconductor package and a back surface, the semiconductor package being mounted on the mounting member via a bonding material,
- wherein
- an island projected region is defined as a region in the substrate obtained by projecting an outline of the island along a normal line with respect to the front surface,
- a part of or entire of the island projected region is configured as a through hole that connects between the front surface and the back surface, or configured as a concave portion recessed from the front surface towards the back surface,
- the sensor unit is a semiconductor element provided with a MEMS sensor, and
- the sensor unit is provided with a fixed electrode and a variable electrode, and outputs a signal responding to an electrostatic capacitance between the fixed electrode and the variable electrode.
5 more elements
An electronic apparatus comprising:
- a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, an island on which the sensor unit is mounted, a lead frame having a plurality of leads and a sealing resin that covers a part of the lead frame and the sensor unit;
- and
- a mounting member including a substrate having a front surface that faces the semiconductor package and a back surface, the semiconductor package being mounted on the mounting member via a bonding material,
- wherein
- an island projected region is defined as a region in the substrate obtained by projecting an outline of the island along a normal line with respect to the front surface,
- a part of or entire of the island projected region is configured as a through hole that connects between the front surface and the back surface, or configured as a concave portion recessed from the front surface towards the back surface, and
- the mounting member includes a plurality of convex portions in a region immediately below the semiconductor package and a region positioned outside the island projected region, the plurality of convex portions protruding in a direction towards the front surface from the back surface.
4 more elements
Dependencies are inferred from the claim text.