Machine for optical bonding, system and method of use thereof

A method of optical bonding a first flat substrate and a second flat substrate, the method comprising:

• dispensing a fill material across a surface of the first flat substrate;
• moving at least one of the first flat substrate or the second flat substrate in at least a horizontal direction with respect to each other after the second flat substrate receives an amount of an adhesive on a side of the second flat substrate;
• and
• contacting the second flat substrate with the first flat substrate until the second flat substrate is bonded to the first flat substrate, wherein the first flat substrate and the second flat substrate remain flat during the contacting;
• wherein the adhesive on the second flat substrate contacts the fill material on the first flat substrate, prior to a contact between the second flat substrate and the fill material, and, as the adhesive initially contacts the fill material, the first flat substrate is separated from the second flat substrate by a uniform distance across an entire width of the second flat substrate;
• wherein a flow of the fill material between the first flat substrate and the second flat substrate caused by the contacting is contained between the first flat substrate and the second flat substrate.

A method of optical bonding a first substrate and a second substrate, the method comprising:

• dispensing a fill material across a surface of the first substrate;
• moving at least one of the first substrate or the second substrate in at least a horizontal direction with respect to each other after the second substrate receives an amount of an adhesive on a side of the second substrate;
• and
• contacting the second substrate with the first substrate until the second substrate is bonded to the first substrate, wherein a shape of the first substrate and a shape of the second substrate remains unchanged as a part of the contacting;
• wherein the adhesive on the second substrate contacts the fill material on the first substrate, prior to a contact between the second substrate and the fill material;
• wherein an air gap between the first substrate and the second substrate proximate a perimeter of each substrate is filled with the fill material without a frame member therebetween.